Cambridge Nanotech Atomic Layer Deposition

A Cambridge Nanotech (USA) Savannah S200 atomic layer deposition (ALD) system was purchased for conformal growth of metal oxide films. ALD is the growth of films by sequential, self-limiting, surface chemical reactions and thus allows for precise thickness control. This system is capable of depositing nearly any metal oxide (e.g., TiO2, Al2O3) and is upgradable for metal sulfide deposition. This tool is housed in N. Lewis laboratories and is available for other users at Caltech and through the EFRC. We expect future applications of the ALD in deposition on porous photonic crystals being studied by researchers in the EFRC, as ALD is the only technique for uniformly coating such structures.